The International Corrugated Packaging Foundation (ICPF) attended the 2024 “Packaging Jamboree,” hosted at the University of Wisconsin-Stout as a Platinum sponsor.

The event was attended by over 160 packaging students from programs across the country, including Michigan State University, Clemson University, Virginia Tech, Rutgers University, and more.

As part of the event, ICPF and students attended keynote and breakout sessions discussing the industry’s growing emphasis on sustainability, ways to capitalize on the capability of machine learning, and how to foster professional growth in the industry.

ICPF and attendees also toured UW-Stout’s packaging design and testing labs and participated in a career fair for students to network with industry professionals and learn more about career opportunities.

ICPF promoted several student-focused resources, such as the free career portal, newly developed Jobs Quiz, and updated website. As the nation’s only student-led packaging conference, the annual event presents a valuable opportunity to educate our future workforce and promote the vast opportunities in the corrugated packaging industry.

ICPF encourages attendance or becoming a sponsor for Pack Jam 2025 at the Rochester Institute of Technology in New York.

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