The PMMI Foundation, the charitable arm of PMMI, The Association for Packaging and Processing Technologies, announced the recipients of the 2024 PACK EXPO scholarships. This year, six students from North American colleges and universities have each been awarded a $5,000 scholarship to support their academic pursuits and career development in the packaging and processing industries.
Each year, the PMMI Foundation awards over $200,000 in scholarships to students pursuing degrees in fields such as packaging, food processing, engineering, and mechatronics. Students must demonstrate academic excellence, major in engineering, packaging, processing, mechatronics, or a related field, and show a strong commitment to advancing the industry.
The 2024 PACK EXPO scholarship recipients include: Morgan Bartholomew, Pennsylvania College of Technology, Polymer & Plastics Engineering; Amy Foo, California Polytechnic State University, San Luis Obispo, Industrial Technology and Packaging; Mattias Fowler, Hennepin Technical College, Mechatronics; Madison Robers, Michigan State University, Packaging Science; Ethan Sawyer, Tennessee Technological University, Mechanical Engineering; and Blake Strickland, Cape Fear Community College, Industrial Engineering Technology.