The AWA Label Release Liner Seminar 2024 will be held on September 8-9, just before the commencement of Labelexpo Americas 2024 in Chicago, Illinois. This seminar will be one of the three concurrent sessions through a collaboration between AWA, TLMI, and AIPIA.
The AWA Label Release Liner Seminar will feature a detailed agenda and combined networking breaks with two other concurrent sessions that cater to the diverse needs of the industry: AWA & TLMI PrintThink Seminar and AWA & AIPIA Smart Labeling Seminar.
The program of the Label Release Liner Seminar will feature keynote presentations and panel discussions addressing sustainability along the value chain, technology advancements, and market challenges. A roundtable discussion will take place with leaders along the value chain, addressing the future of release liner and pressure sensitive labeling.
Running in parallel, the three interconnected seminars will provide the most comprehensive program on labeling, release liner, print, and smart technology, making it the ideal start to Labelexpo week. Suppliers, converters, brand owners, and other stakeholders will find the series the perfect platform to network, discuss emerging trends, and prepare for the road ahead.
The welcome reception on September 8 will feature a networking opportunity, including a special keynote presentation by Craig Miller, president of MCC.
